Lantronix · Modules and compute
xPico 600
Hostless embedded IoT gateway module with dual-band Wi-Fi 6, Bluetooth LE 5.4 and Ethernet, in LGA and M.2 versions.
- Dual-band Wi-Fi 6
- Bluetooth LE 5.4
- -40 to +85 °C
- LGA or M.2 3030

Overview
The xPico 600 is an embedded IoT gateway module that adds secure Wi-Fi 6, Bluetooth LE 5.4 and Ethernet to OEM products. Its hostless design means it can run without an external host microcontroller, or act as a network co-processor that offloads networking from an existing MCU. TruPort Serial and TruPort Socket handle serial pass-through and TCP, UDP or TLS connections. The module is pre-integrated with Percepxion for secure updates and device management, and its radio approvals include India.
Built for
- Adding Wi-Fi to industrial machines and controllers
- Connected medical devices
- Retail and resource management equipment
- Modbus RTU devices needing Modbus TCP access
Key features
Hostless or co-processor
Runs as a wireless MCU with the SDK, or offloads all networking from the host over UART.
Wi-Fi 6 and BLE 5.4
Dual-band 802.11ax with separate antennas so Wi-Fi and Bluetooth run at the same time.
Concurrent soft AP and client
Allows direct wireless service access without disrupting the machine's network connection.
InfiniShield security
Secure boot, secure firmware-over-the-air updates, encrypted configuration, WPA3 Enterprise and TLS 1.3.
Percepxion ready
Secure device updates, remote management and support for Cyber Resilience Act compliance.
Specifications
- Wi-Fi
- 802.11a/b/g/n/ac/ax, 2.4 and 5 GHz, 1x1, 20 MHz
- Bluetooth
- BLE 5.4, central and peripheral roles
- Ethernet
- Integrated 10/100BASE-T PHY (external magnetics required)
- Host interfaces
- TTL UART 9600 bps to 4 Mbps, USB host, 12 programmable I/O
- Security
- WPA3 Enterprise, TLS 1.3, AES-256, secure boot, secure FOTA
- Protocols
- TCP/IP, UDP, IPv4/IPv6, DHCP, HTTP(S), SNMP v1/v2, Modbus TCP to RTU
- Form factors
- LGA 18 x 28.5 x 3.15 mm, or M.2 3030 E-key
- Operating temperature
- -40 to +85 °C
- Radio approvals
- USA, Canada, EU, Japan, Taiwan, China, India
Models
| Model | What it is | Key specs |
|---|---|---|
| XPC600100S | LGA module, production | Tape and reel of 500 |
| XPC600300S | M.2 3030 module, production | Tray |
| XPC600100P, XPC600300P | Sample modules | LGA or M.2 3030 |
| XPC600100EK | Evaluation kit | Includes M.2 3030 module, dual U.FL antennas |
Specifications as published by Lantronix. Configurations vary by model; we will confirm the exact build with your quote.
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