ProductsReflex CESXpressVUP-LP9PI2

Reflex CES · PCIe boards

XpressVUP-LP9PI2

Fanless, industrial-temperature PCIe board with a Virtex UltraScale+ VU9P for rugged and defence systems.

  • Virtex US+ VU9P
  • PCIe Gen3 x16
  • -40 to 70 C
  • 16 GB DDR4
  • Fanless
XpressVUP-LP9PI2

Overview

The XpressVUP-LP9PI2 is a low-profile PCIe accelerator built around an industrial temperature grade AMD Virtex UltraScale+ VU9P FPGA. It has 16 GB of DDR4, 576 Mbit of QDR2+ and two QSFP28 cages, and it is cooled by a passive 2-slot heatsink with no fan. Acrylic conformal coating and a -40 to 70 C operating range target sealed industrial and rugged defence systems.

Built for

  • Fanless industrial automation
  • Radar and electronic warfare
  • Signal intelligence platforms
  • Industrial networking and edge computing

Key features

Fanless design

A passive 2-slot heatsink cools the board without a fan for sealed enclosures.

Industrial temperature

The FPGA and bill of materials are industrial grade, rated -40 to 70 C.

Conformal coating

An acrylic coating protects the board in harsh environments.

Large memory

Two DDR4 banks total 16 GB and two QDR2+ banks total 576 Mbit.

Dual QSFP28

Two QSFP28 cages support 10 to 100 GbE and 2 x 100 GbE.

Reference designs

Ships with Vivado 2023.1 HDL designs and a PCIe reference design using AMD QDMA IP.

Specifications

FPGA
AMD Virtex UltraScale+ XCVU9P-2FLGB2104I
Logic
2.6M system logic cells
UltraRAM
270 Mb
Host interface
PCIe Gen3 x16
Network
2x QSFP28, up to 2 x 100 GbE
DDR4
2 banks, 16 GB total, 2666 MT/s
QDR2+
2 banks, 576 Mbit total, 550 MHz
Cooling
2-slot passive heatsink, fanless
Protection
Acrylic conformal coating
Power
120 W max
Operating temp
-40 to 70 C
Dimensions
68.9 x 167.7 mm, low profile
Design tools
Vivado 2023.1

Specifications as published by Reflex CES. Configurations vary by model; we will confirm the exact build with your quote.

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